Patterned Diamond
Patterned Diamond
LASER MICRO MACHINING
Patterned Diamond and Laser Microchannel Processing
What Is Patterned Diamond?
Patterned diamond uses ultrashort-pulse lasers to create regular microstructures on the diamond surface, giving the material designed channels, cutting points, or geometric patterns. Key products include diamond microfluidic channels and patterned CMP diamond dressers. Laser micromachining capabilities can also be extended to copper, aluminum, aluminum oxide, aluminum nitride, sapphire, glass, and other materials.
Laser processing requires no photomask and is suitable for customized pattern prototyping, small-batch validation, and geometric-parameter adjustment. Actual channel dimensions, aspect ratio, edge quality, heat-affected zone, and batch-processing capability must still be evaluated according to the material, thickness, and drawings.
MICROCHANNEL APPLICATION
How Can Diamond Microchannels Improve Cooling for High-Heat-Flux Components?
Diamond microfluidic channels can be designed as straight, serpentine, or branching channels around component hot spots, bringing coolant closer to the heat source and shortening the heat-transfer distance. They are suitable for liquid-cooled substrates used with AI chips, CPUs/GPUs, high-power lasers, and power amplifiers.
In addition to channel width, depth, and spacing, the design must account for coolant, flow rate, pressure drop, inlet and outlet locations, sealing method, and bonding structure. Cooling performance should not be judged solely by a single channel dimension.
CMP DIAMOND DRESSER
Which Processes Use Patterned Diamond Disc Dressers?
CMP diamond disc dressers use regularly arranged conical protrusions or geometric cutting patterns to control cutting-point shape, height, density, and spacing. They can be used to condition polishing pads in semiconductor wafer CMP, sapphire, SiC, and other precision grinding and polishing processes.
Selection should be based on polishing-pad material, slurry, target material-removal rate, dressing pressure, rotational speed, and service-life requirements when designing the pattern, rather than simply comparing diamond particle size.
TECHNICAL EVALUATION
What Information Is Required for a Laser Micromachining Quotation?
For microchannel processing, please provide the substrate type and dimensions, 2D/3D drawings, channel width, depth, spacing, surface and edge requirements, coolant, and flow-rate and pressure-drop conditions. For dresser projects, please also provide the polishing pad, slurry, workpiece material, target material-removal rate, dressing parameters, and estimated quantity.
