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Diamond Metallization

DIAMOND METALLIZATION

Diamond Metallization Contract Manufacturing Services

Perfectly Joining Diamond and Metal

Diamond possesses unparalleled thermal conductivity, but its highly inert chemical properties prevent it from being directly welded or integrated with metal substrates for packaging. We specialize in diamond surface metallization processes. Through precision coating technology, we enable diamond thermal management components to be stably and reliably integrated with chips, substrates, and package structures, allowing them to fully realize their thermal dissipation potential.

Metallization
KEY TECHNOLOGY

Why Metallization Is a Key Technology

Diamond consists of an sp³ covalent-bond structure, and its surface exhibits virtually no wetting reaction with metals. Without metallization pretreatment, even a high-performance diamond heat spreader cannot be effectively soldered to a chip or substrate. Our metallization process is the essential bridge that transforms diamond from a “material” into an “assembly-ready thermal management component”:

01

Transition Layer Coating Transition Layer

  • Carbide-forming elements such as chromium (Cr) and titanium (Ti) are used to react with carbon atoms on the diamond surface, generating a stable carbide layer and forming strong chemical bonds.
02

Surface Enhancement Treatment Surface Enhancement

  • Additional layers of metals such as Ni, Au, Ag, and Cu can be deposited to improve solderability and oxidation resistance.
03

Vacuum Brazing / Sintering Vacuum Brazing / Sintering

  • Brazing or sintering is performed in a vacuum environment to prevent oxidation and contamination from impurities, ensuring reliable interfaces and efficient thermal transfer.
APPLICATIONS

Applications

High-Power Device Packaging: After metallization of diamond heat sinks or substrates, they can be directly soldered and assembled with chips or package carriers such as CPUs/GPUs and laser diodes.
Diamond Tool Inserts: Metallization of PCD/CVD diamond tool tips facilitates brazed attachment to the tool body.
Diamond Composite Material Manufacturing: In Cu-Diamond composite material processes, diamond particles must first be metallized to form a strong interfacial bond with the copper substrate and avoid interfacial thermal resistance along the heat-transfer path.
PROCESS CAPABILITY

Our Process Capabilities

From coating technologies such as vacuum sputtering and electron-beam evaporation to the integration of vacuum brazing and sintering, we provide comprehensive diamond metallization contract manufacturing services. We can also customize transition-layer materials and coating-thickness combinations according to the customer's thermal management substrate specifications.

PRODUCT ADVANTAGES

Product Advantages at a Glance

Feature Advantages of Diamond Metallization
Bond Strength Stable chemical bonding for long-term reliability
Thermal Conductivity Reduces interfacial thermal resistance and maximizes diamond's heat-dissipation performance
Process Vacuum processing prevents oxidation and contamination from impurities
Application Flexibility Coating combinations can be customized according to substrate and packaging requirements
CONTACT US

Contact us to learn more about our diamond metallization contract manufacturing services

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