Diamond Powder

THERMAL DIAMOND POWDER

High-Thermal-Conductivity Solutions at the Microscopic Scale

We provide diamond powder products designed specifically for thermal management applications. Leveraging the outstanding thermal conductivity of diamond particles, our products serve as key raw materials for thermal interface materials (TIMs), composite fillers, and various thermal pastes and heat spreaders, helping customers enhance overall thermal management system performance at the microscopic scale.

CORE FEATURES

Core Advantages

Exceptional Thermal Conductivity

Exceptional thermal conductivity: Diamond powder offers significantly higher thermal conductivity than metals such as copper and aluminum, effectively improving the thermal performance of composite materials.

Wide Range of Particle Sizes

Wide range of particle sizes: Various particle size options are available, allowing flexible selection based on filler loading, dispersibility, and application requirements.

Stable Chemical Properties

Stable chemical properties: Highly chemically inert, with excellent resistance to degradation under high-temperature or long-term operating conditions, ensuring consistently stable thermal performance.

Excellent Dispersion and Compatibility

Excellent dispersion and compatibility: Surface treatment can be applied according to customer formulation requirements to improve dispersion uniformity in resins, oils, and other matrices.

APPLICATIONS

Key Application Areas

Thermal interface materials (TIMs): Used as high-thermal-conductivity fillers in thermal pastes and thermal sheets to improve heat transfer efficiency across the interface between chips and heat sinks.

Metal matrix composite fillers: Diamond powder is added to composites such as copper-diamond (Cu-Dia) and aluminum silicon carbide (AlSiC) to maximize overall thermal management performance.

Raw material for pre-metallization processes: A base raw material for diamond powder metallurgy, used in the manufacture of sintered copper-diamond composite materials.

Advanced thermal paste formulations: Used in the development of thermal paste products for high-power electronic components such as CPUs and GPUs.

PRODUCT ADVANTAGES

Product Advantages at a Glance

Characteristic	Advantages of Diamond Powder for Thermal Management
Thermal conductivity	Far superior to conventional metallic fillers
Particle size selection	Multiple particle size specifications for flexible application matching
Stability	Highly chemically inert and resistant to degradation during long-term use
Application flexibility	Suitable for a wide range of formulations, including TIMs, composites, and metal sintering

PROCESS CAPABILITY

Our Process Capabilities

From diamond powder screening and classification to surface treatment and particle size combination recommendations tailored to customer formulation requirements, we provide a stable and reliable supply of diamond powder for thermal management applications. We can also customize particle size distributions and supply specifications according to each customer's application.

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