Diamond Disc Conditioner

Product Details

LASER-PATTERNED DIAMOND DISC CONDITIONER

Regular Patterns for Precise Conditioning Every Time

Using laser micromachining technology, we ablate regularly arranged patterned microstructure arrays onto the surface of diamond discs. Replacing the random distribution of diamond particles found in conventional electroplating or sintering processes, our high-precision CMP polishing pad conditioners deliver more stable and predictable conditioning performance for the semiconductor and precision grinding industries.

CORE TECHNOLOGY CAPABILITY

Core Technology Capabilities

Precision Laser Micromachining

Ultrashort-pulse lasers directly ablate and form the diamond disc surface without a mask, precisely replicating the shape, height, and spacing of every conditioning point.

Patterned Arrangement Design

Pattern arrangements such as conical protrusions and specific geometric cutting-edge patterns can be designed according to the polishing pad material, slurry characteristics, and target conditioning performance.

Uniform, Controllable Conditioning Performance

The regular distribution of cutting points replaces the random distribution of conventional particles, substantially improving the consistency of polishing pad surface texturing.

Custom Pattern Design

Pattern density, protrusion height, and arrangement spacing can be adjusted to meet customer process requirements, optimizing material removal rate (MRR) and conditioning life.

TECHNICAL ADVANTAGES

Technical Advantages

Consistent Conditioning Performance: Compared with conventional sintered conditioners, the patterned structure effectively reduces variation in conditioning performance between batches.

Extended Cutting-Edge Life: Cutting-edge angles and tip geometries can be designed according to conditioning requirements, reducing tip wear rates and the frequency of conditioner replacement.

Enhanced Process Stability: Uniform conditioning performance helps maintain long-term stability in slurry flow and material removal rate during the CMP process.

APPLICATIONS

Applications

Polishing pad conditioning for semiconductor wafer CMP (chemical mechanical planarization) processes

Polishing pad conditioning for hard, brittle materials such as sapphire and SiC

Pad material maintenance for other precision grinding and polishing processes

PROCESS CAPABILITY

Our Process Capabilities

From diamond disc substrate selection and laser pattern design to microstructure formation and quality inspection, we provide one-stop contract manufacturing services for laser-patterned diamond disc conditioners. We can also customize pattern designs and processing parameters according to customers' polishing pad specifications and process requirements.

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