Microfluidic Channels

Product Details

DIAMOND MICROCHANNEL MACHINING

The Final Mile of Thermal Management, Etched into Diamond

We provide precision microchannel machining services for diamond plates. Using ultrashort-pulse laser micromachining technology, we directly ablate microchannel structures onto the surface of diamond substrates or heat spreaders. This upgrades diamond from a passive thermal substrate into a functional thermal component with active liquid-cooling capabilities, meeting the demand for extreme thermal efficiency in high-power-density devices.

CORE TECHNOLOGY CAPABILITY

Core Technology Capabilities

Precision Laser Micromachining: Ultrashort-pulse lasers, such as femtosecond lasers, are used to directly ablate and form structures on the diamond surface without masks, delivering high precision and a minimal heat-affected zone

Versatile Channel Designs: Straight, serpentine, dendritic, and other channel geometries can be designed according to thermal-management requirements to optimize coolant flow paths and heat-exchange efficiency

Customized Dimensions and Density: Channel width, depth, and spacing can all be flexibly adjusted according to the chip's hotspot distribution and power-density requirements

Rapid Prototyping Capability: No tooling or masks are required, making the process suitable for rapid validation and prototyping of small-batch, customized patterns

TECHNICAL ADVANTAGES

Technical Advantages

Significantly Enhanced Active Cooling Performance: Compared with conventional planar diamond heat spreaders, microchannel structures bring the coolant directly closer to the heat source, substantially shortening the heat-transfer path

Precise Alignment with Hotspot Distribution: Channel layouts can be customized according to the chip's actual heat-generating regions, strengthening thermal management specifically around localized hotspots

Preservation of Diamond's Superior Thermal Conductivity: The process applies microstructural treatment only to the surface, leaving the diamond substrate's inherently high thermal conductivity unaffected

APPLICATIONS

Applications

Liquid-cooled thermal substrates for high-power-density semiconductor devices

Active cooling solutions for high-heat-density devices such as CPU/GPU and AI chips

Precision thermal-management applications for high-power laser diodes and power amplifiers

PROCESS CAPABILITY

Our Process Capabilities

From diamond plate substrate selection and laser channel design to microchannel formation and quality inspection, we provide one-stop contract manufacturing services for diamond microchannel machining. Channel geometry and machining specifications can also be customized according to the customer's chip hotspot distribution and thermal-management system design.

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