Product Details
Extreme Heat Dissipation, Diamond-Class Peak Performance
Single-crystal diamond heat spreaders are made from CVD single-crystal diamond. Their grain-boundary-free structure ensures consistent heat conduction and uniform efficiency. With thermal conductivity exceeding 2000 W/m·K, it is the solid material with the highest known thermal conductivity, purpose-built for high-power, high-density applications with the most demanding thermal management requirements.

Key Feature Advantages
Ultra-High Thermal Conductivity
The single-crystal structure eliminates grain-boundary scattering, delivering thermal conductivity above 2000 W/m·K—far surpassing conventional heat-dissipation materials such as copper (~400 W/m·K).
Isotropic Heat Conduction
Heat propagates consistently through the crystal lattice, providing stable and uniform thermal dissipation efficiency without localized thermal resistance from grain boundaries.
Exceptional Surface Quality
Combined with precision grinding, polishing, and CMP/PMP processes, surface roughness can reach the sub-nanometer level. Bonding technology ensures optimal attachment at the chip interface.
Stable and Reliable
Outstanding chemical stability and mechanical strength make it suitable for long-term operation in high-power-density environments.
Applications
Our Process Capabilities
From CVD single-crystal diamond growth and precision cutting to surface grinding, polishing, and metallization, we provide one-stop contract manufacturing services for single-crystal diamond heat spreaders. Customized production is available according to the customer's chip dimensions and thermal specifications.
Contact us to discuss a fully customized, end-to-end solution for CVD single-crystal diamond heat spreaders.
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