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Polycrystalline Diamond

Product Details

POLYCRYSTALLINE DIAMOND HEAT SPREADER

Large-Area Heat Dissipation Balancing Performance and Cost

Polycrystalline diamond heat spreaders are made from CVD polycrystalline diamond. While maintaining thermal conductivity far superior to copper (~400 W/m·K), they overcome the size limitations imposed by the growth of single-crystal diamond and can be manufactured as larger-area thermal substrates, making them an ideal choice for thermal management in mass-produced high-power devices.

材料熱傳導率
CORE FEATURES

Key Advantages

01

Outstanding Thermal Conductivity

Thermal conductivity reaches 1000–1800 W/m·K, far outperforming conventional copper and aluminum thermal management materials

02

Large-Size Manufacturing Capability

Can be fabricated into large-area substrates from 2" to 6", meeting the coverage requirements of package- and chip-level thermal management

03

Stable Mechanical and Chemical Properties

Wear-resistant and corrosion-resistant, enabling long-term stable operation in harsh working environments

APPLICATIONS

Applications

Package submounts for AI chips and high-power computing components
Thermal management solutions for large-area heat sources such as CPUs/GPUs
Thermal management substrates for electronic components such as power amplifiers and high-power LEDs
PROCESS CAPABILITY

Our Process Capabilities

From CVD polycrystalline diamond growth and precision cutting to surface grinding, polishing, and metallization, we provide one-stop contract manufacturing services for polycrystalline diamond heat spreaders, with customized production based on the dimensions, thickness, and surface specifications of our customers’ thermal management substrates.

01各種尺寸
尺寸比例
CONTACT US

Contact us to discuss a fully customized, end-to-end CVD polycrystalline diamond heat spreader solution

[ Inquire About Customized Solutions Now ]

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