Diamond Composite Material (Copper-Diamond)
Title One
Combining Copper's Electrical Conductivity with Diamond's Thermal Conductivity
Copper-diamond composite material combines copper's high electrical conductivity with diamond's exceptional thermal conductivity. Through metallization and composite processing, it delivers a heat dissipation solution with high thermal conductivity and an adjustable coefficient of thermal expansion—an ideal choice between pure copper and pure diamond that balances performance and cost.
Key Advantages
High Thermal Conductivity
Combining the high thermal conductivity of diamond particles, the overall thermal conductivity is significantly higher than that of pure copper (~400 W/m·K)
Adjustable Coefficient of Thermal Expansion
By adjusting the composite ratio of diamond and copper, the coefficient of thermal expansion can be matched to that of semiconductor chips, reducing packaging stress
Versatile Composite Forms
Different processing routes, including powder metallurgy and sputtered composites, are available to meet the structural requirements of various applications
Excellent Mechanical and Packaging Compatibility
Combines the solderability of metal with the high hardness and wear resistance of diamond
Main Product Forms
Applications
Our Process Capabilities
From diamond surface metallization and powder metallurgy sintering to sputtered composites and precision machining, we provide one-stop contract manufacturing services for copper-diamond composite materials. We can also customize the diamond-to-copper composite ratio and dimensions according to the customer's packaging specifications.
Contact us to learn more about our one-stop copper-diamond composite material contract manufacturing services
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Diamond Composite Material (Copper-Diamond) |