Diamond Wafer/Substrate

Diamond Wafer/Substrate

The Diamond Wafer marks a significant milestone in semiconductor technology, symbolizing the transition from the “silicon era” to the “carbon era.”

Diamond technology applications span across multiple fields, including thermal management, optics, semiconductors, tools, biomedicine, quantum technology, and energy. Its core values lie in its high thermal conductivity, extreme hardness, optical transparency, biocompatibility, and quantum properties. With continuous advancements in diamond cultivation technology, the cost of diamond materials is gradually decreasing, and their application scope and market potential will continue to expand.

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Thermal-Grade DiamondWith its exceptionally high thermal conductivity (>1500 W/m·K), thermal-grade diamond has become the material of choice for thermal management applications. Its use in high-power and high-density electronic components helps dissipate heat, prevent overheating, and enhance system reliability and performance.

Category

Single-Crystal Diamond

Polycrystalline Diamond

Thermal conductivity

≧ 2000 W/(m·k)

1000~2000 W/(m·k)

Thermal expansion coefficient

1.1x 10 -6 /℃

3.1962x 10 -6 /℃


Applications
  • Thermal Interface Materials (TIMs): Used between chips, modules, and heat sinks to reduce thermal resistance and improve heat transfer efficiency.
  • Electronic Packaging and Substrates: Provides outstanding thermal management in semiconductor packaging, enabling devices to operate under higher power density conditions.
  • LEDs, Optoelectronics, and Related Components: Enhances thermal performance of optoelectronic devices, extending lifespan while improving brightness and efficiency.

Mono Crystal Substrate

 
 

Type

Product Model

Thermal Conductivity*

Mono-Crystalline

CVD

SDN0

2403

SDN0.25

2138

SDN0.5

1865

SDN2

1730

SDN4

1528

SDN8

1450

Poly-Crystalline

CVD

PDC1500

1530

PDC1200

1255

PDC1000

1051

PDD1000

1090

PDD800

825

HPHT

PDH700

684

PDH600

494

複合材

壓鑄

CuD600

610

Metal

-

Cu

400


* Thermal Conductivity Measurement Methods: Time-Domain Thermo Reflectance (TDTR) and Laser Flash Analysis (LFA), both transient thermal measurement techniques.
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